Published June 2005 | Version Published
Book Section - Chapter Open

Parylene-strengthened thermal isolation technology for microfluidic system-on-chip applications

  • 1. ROR icon California Institute of Technology

Abstract

Here we reported a novel technology using parylene-cross-linking structure to achieve on-chip air-gap thermal isolation for microfluidic system-on-chip (SOC) applications. Two applications based on this technology, on-chip continuous-flow polymerase chain reaction (PCR) and on-chip temperature gradient liquid chromatography (LC) were successfully demonstrated. Device thermal performance in each example was characterized. Results showed that our technology not only provides excellent on-chip thermal isolation but also its simplicity of integration with other on-chip components makes versatile microfluidic SOC applications feasible.

Additional Information

© 2005 IEEE. This work was supported by the NSF Center for Neuromorphic Systems Engineering (CNSE) at Caltech. The authors would also like to thank Mr. Trevor Roper for his assistance in processing.

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Eprint ID
94078
Resolver ID
CaltechAUTHORS:20190322-155554314

Funding

Center for Neuromorphic Systems Engineering, Caltech

Dates

Created
2019-03-22
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Updated
2021-11-16
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