CaltechAUTHORS
Published January 2000 | Version Published
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Flexible shear stress sensor skin for aerodynamics applications

Creators

  • 1. ROR icon California Institute of Technology

Abstract

Packaging for a large distributed sensing system is a challenging topic. Using flexible skin technology solves many of these problems. Combining with the newly developed backside contact technique, sensor packaging is made even easier by completely avoiding the fragile bonding wires. This paper describes the improved flexible MEMS technology and its application to the fabrication and packaging of practical shear stress sensor skins. An airflow separation detection system including these skins, MOSIS bias circuits and a data acquisition unit has been successfully tested in windtunnel and is being used for the aerodynamic study of a MEMS controlled super-maneuverable low-altitude unmanned aerial vehicle (UAV).

Additional Information

© 2000 IEEE. This work is supported by DARPA under Navy Contract N66001-97-C-8610. The authors would like to thank Trevor Roper and Hung Bui for fabrication assistance, Chen-Wei Chiu from Umachines Inc. for electro less Nil Au plating, Dave Ganzer, Emil Ghapgharan and Mark Levoe for the UAV flight test.

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Additional details

Identifiers

Eprint ID
94605
Resolver ID
CaltechAUTHORS:20190409-152036983

Funding

Office of Naval Research (ONR)
N66001-97-C-8610

Dates

Created
2019-04-09
Created from EPrint's datestamp field
Updated
2021-11-16
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