Published 2001
| Version public
Book Section - Chapter
BrF₃ Dry Release Technology for Large Freestanding Parylene MEMS
Creators
Contributors
Other:
Abstract
We report here a dry release technology for making large freestanding surface micromachined Parylene MEMS. The technology is a two-step process that combines wet photoresist dissolution with dry silicon etching by bromine trifluoride (BrF₃). With photoresist as the sacrificial layer dissolved using acetone, large Parylene MEMS devices can be achieved. A final dry release in BrF₃ vapor helps free the devices. For example, we have successfully fabricated freestanding 1-mm-long cantilevers, 2-mm-long bridges, and 2-mm-diameter diaphragms. These structures are suitable for fully integrated MEMS devices such as accelerometers, gyros and microphones.
Additional Information
© 2001 Springer-Verlag Berlin Heidelberg. The authors would like to thank Mr. Zhigang Han for some initial testing and Mr. Trevor Roper for fabrication assistance. This project is partially supported by NSF Engineering Research Center for Neuromorphic Engineering (CNSE) and DARPA under contract DABT 63-98-C-0005.Additional details
Identifiers
- Eprint ID
- 100938
- DOI
- 10.1007/978-3-642-59497-7_155
- Resolver ID
- CaltechAUTHORS:20200127-100810992
Related works
- Describes
- 10.1007/978-3-642-59497-7_155 (DOI)
Funding
- NSF
- Defense Advanced Research Projects Agency (DARPA)
- DABT 63-98-C-0005
- Center for Neuromorphic Systems Engineering, Caltech
Dates
- Created
-
2020-01-29Created from EPrint's datestamp field
- Updated
-
2021-11-16Created from EPrint's last_modified field