CaltechAUTHORS
Published July 1, 2015 | Version public
Journal Article Metadata-only

Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing

Creators

  • 1. ROR icon National Taiwan University
  • 2. ROR icon California Institute of Technology
  • 3. ROR icon Industrial Technology Research Institute
  • 4. ROR icon Institute of Physics, Academia Sinica

Abstract

We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at T_(Hot) ⩽ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.

Additional Information

© 2015 Elsevier Ltd. Received 19 August 2014; Accepted 23 March 2015. This work is financially supported by National Science Council of Taiwan through Grant 101-2221-E-002-162-MY3, the Electronics and Optoelectronics Research Laboratories of Industrial Technology Research Institute, and the Caltech DOW-Bridge program.

Additional details

Identifiers

Eprint ID
60197
DOI
10.1016/j.enconman.2015.03.089
Resolver ID
CaltechAUTHORS:20150911-123045614

Funding

National Science Council (Taipei)
101-2221-E-002-162-MY3
Industrial Technology Research Institute
Caltech DOW Bridge Program

Dates

Created
2015-09-11
Created from EPrint's datestamp field
Updated
2021-11-10
Created from EPrint's last_modified field