Published June 6, 2017 | Version Supplemental Material
Journal Article Open

Use of Supramolecular Assemblies as Lithographic Resists

Abstract

A new resist material for electron beam lithography has been created that is based on a supramolecular assembly. Initial studies revealed that with this supramolecular approach, high-resolution structures can be written that show unprecedented selectivity when exposed to etching conditions involving plasmas.

Additional Information

© 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim. Manuscript received: January 9, 2017; Revised manuscript received: March 31, 2017; Version of record online: May 15, 2017. We acknowledge the EPSRC (UK) for funding (EP/L018470/1), including a studentship within the Centre for Doctoral Training "NoWNANO" (to S.V.) and a Doctoral Prize (to G.F.S.W.). The University of Manchester also supported this work. We gratefully acknowledge critical support and infrastructure provided for this work by the Kavli Nanoscience Institute at Caltech. Conflict of interest: There are two patents held by three authors (S.M.L., S.G.Y., R.E.P.W.) based on the work described in the paper.

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Additional details

Identifiers

Eprint ID
77459
DOI
10.1002/anie.201700224
Resolver ID
CaltechAUTHORS:20170515-133021292

Funding

Engineering and Physical Sciences Research Council (EPSRC)
EP/L018470/1
University of Manchester

Dates

Created
2017-05-15
Created from EPrint's datestamp field
Updated
2021-11-15
Created from EPrint's last_modified field

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