Combined thermoelastic stress analysis and digital image correlation with a single infrared camera
Abstract
A novel methodology simultaneously combining thermoelastic stress analysis (TSA) and digital image correlation (DIC) with a single infrared camera is presented. DIC is an optical method to determine deformation by image tracking with strains determined via differentiation. TSA is a non-contact measurement technique that provides the full-field stress directly using measured temperature changes. The combination of the two techniques improves the resolution and accuracy of TSA results by correcting for sample motion and distortion during loading. Illustrative examples, including an aluminium alloy plate with an edge crack and a nylon plate with a hole under tension, demonstrate the combined method which simultaneously measures stress and displacement.
Additional Information
© 2011 The Authors. © 2011 Institution of Mechanical Engineers. Received April 30, 2011; Accepted July 7, 2011. Published online before print September 9, 2011. This work was supported by the US Department of Defense Multidisciplinary University Research Initiative programme at the California Institute of Technology on Mechanics and Mechanisms of Impulse Loading, Damage and Failure of Marine Structures and Materials through the Office of Naval J. Strain Analysis Vol. 46 Research (grant number N00014-06-1-0730) (Dr Y. D. S. Rajapakse, Program Manager).Additional details
Identifiers
- Eprint ID
- 28283
- DOI
- 10.1177/0309324711418286
- Resolver ID
- CaltechAUTHORS:20111202-122006740
Funding
- U. S. Department of Defense Multidisciplinary University Research Initiative programme at Caltech
- Office of Naval Research
- N00014-06-1-0730
Dates
- Created
-
2011-12-05Created from EPrint's datestamp field
- Updated
-
2021-11-09Created from EPrint's last_modified field
Caltech Custom Metadata
- Caltech groups
- GALCIT